High density 20μm pitch CuSn microbump process for high-end 3D applications

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Authors
De Vos, Joeri; Jourdain, Anne; Erismis, Mehmet Akif; Zhang, Wenqi; De Munck, Koen; La Manna, Antonio; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe
Conference
IEEE 61st Electronic Components and Technology Conference - ECTC
Title
High density 20μm pitch CuSn microbump process for high-end 3D applications
Publication type
Proceedings paper
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