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High density 20μm pitch CuSn microbump process for high-end 3D applications

dc.contributor.authorDe Vos, Joeri
dc.contributor.authorJourdain, Anne
dc.contributor.authorErismis, Mehmet Akif
dc.contributor.authorZhang, Wenqi
dc.contributor.authorDe Munck, Koen
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-19T13:09:20Z
dc.date.available2021-10-19T13:09:20Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18808
dc.sourceIIOimport
dc.titleHigh density 20μm pitch CuSn microbump process for high-end 3D applications
dc.typeProceedings paper
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecDe Munck, Koen::0000-0003-0922-3860
dc.source.peerreviewno
dc.source.beginpage27
dc.source.endpage31
dc.source.conferenceIEEE 61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - imec


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