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Poly-open and metal CMP steps in RMG processing on planar and 3D architecture devices

dc.contributor.authorDevriendt, Katia
dc.contributor.authorKellens, Kristof
dc.contributor.authorVeloso, Anabela
dc.contributor.authorAthimulam, Raja
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-19T13:16:10Z
dc.date.available2021-10-19T13:16:10Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18841
dc.sourceIIOimport
dc.titlePoly-open and metal CMP steps in RMG processing on planar and 3D architecture devices
dc.typeProceedings paper
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorAthimulam, Raja
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization technology - ICPT
dc.source.conferencedate9/11/2011
dc.source.conferencelocationSeoul South-Korea
imec.availabilityPublished - imec


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