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Design of RF feedthroughs in Zero-level packaging for RF MEMS implementing TSVs

dc.contributor.authorEl Gannudi, Hamza
dc.contributor.authorCherman, Vladimir
dc.contributor.authorFarinelli, Paola
dc.contributor.authorPham, Nga
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorTilmans, Harrie
dc.contributor.authorSorrentino, Roberto
dc.date.accessioned2021-10-19T13:22:16Z
dc.date.available2021-10-19T13:22:16Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18869
dc.sourceIIOimport
dc.titleDesign of RF feedthroughs in Zero-level packaging for RF MEMS implementing TSVs
dc.typeProceedings paper
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.conference12th International Symposium on RF MEMS and RF Microsystems - MEMSWAVE
dc.source.conferencedate27/06/2011
dc.source.conferencelocationAthens Greece
imec.availabilityPublished - imec


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