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Influence of the Cu-Te composition and microstructure on the resistive switching of Cu-Te/Al2O3/Si cells
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Influence of the Cu-Te composition and microstructure on the resistive switching of Cu-Te/Al2O3/Si cells
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Date
2011
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Goux, Ludovic
;
Opsomer, Karl
;
Degraeve, Robin
;
Muller, Robert
;
Detavernier, C
;
Wouters, Dirk
;
Jurczak, Gosia
;
Altimime, Laith
;
Kittl, Jorge
Journal
Applied Physics Letters
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1908
since deposited on 2021-10-19
Acq. date: 2025-12-17
Citations
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Views
1908
since deposited on 2021-10-19
Acq. date: 2025-12-17
Citations