Authors

Halder, Sandip; Jourdain, Anne; Claes, Martine; De Wolf, Ingrid; Travaly, Youssef; Beyne, Eric; Swinnen, Bart; Pepper, V.; Guittet, P.Y.; Savage, G.; Markwort, Lars

Conference

IEEE 61st Electronic Components and Technology Conference - ECTC

Title

Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's

Publication type

Proceedings paper