Show simple item record

Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables

dc.contributor.authorGrillaert, Joost
dc.contributor.authorMeynen, Herman
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorVan den hove, Luc
dc.date.accessioned2021-09-30T08:20:39Z
dc.date.available2021-09-30T08:20:39Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1902
dc.sourceIIOimport
dc.titleMinimizing within die non uniformity in CMP by optimising polishing parameters and consumables
dc.typeProceedings paper
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVan den hove, Luc
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage525
dc.source.endpage530
dc.source.conferenceAdvanced Metallization and Interconnect Systems for ULSI Applications in 1996
dc.source.conferencedate1/10/1996
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - open access
imec.internalnotesA parallel session was held in Tokio 23-24 Oct. 1996


Files in this item

Thumbnail
Name:
1871.pdf
Size:
683.9Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record