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A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator

dc.contributor.authorHelin, Philippe
dc.contributor.authorVerbist, Agnes
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorGuo, Bin
dc.contributor.authorSeveri, Simone
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorHaspeslagh, Luc
dc.contributor.authorTilmans, Harrie
dc.contributor.authorNaito, Yasuyuki
dc.contributor.authorOnishi, K.
dc.date.accessioned2021-10-19T14:12:53Z
dc.date.available2021-10-19T14:12:53Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19055
dc.sourceIIOimport
dc.titleA wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator
dc.typeProceedings paper
dc.contributor.imecauthorHelin, Philippe
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorHaspeslagh, Luc
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage982
dc.source.endpage985
dc.source.conference16th International Solid-State Sensors, Acutators and Microsystems Conference - TRANSDUCERS
dc.source.conferencedate5/06/2011
dc.source.conferencelocationBeijing China
imec.availabilityPublished - imec


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