Publication:
A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator
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1964 since deposited on 2021-10-19
1last month
Acq. date: 2026-02-27
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Statistics
Views
1964 since deposited on 2021-10-19
1last month
Acq. date: 2026-02-27
Citations