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A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator
Publication:
A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator
Date
2011
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Helin, Philippe
;
Verbist, Agnes
;
De Coster, Jeroen
;
Guo, Bin
;
Severi, Simone
;
Witvrouw, Ann
;
Haspeslagh, Luc
;
Tilmans, Harrie
;
Naito, Yasuyuki
;
Onishi, K.
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1961
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1961
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations