Publication:

A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator

Date

2011
Proceedings Paper
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dc.contributor.authorHelin, Philippe
dc.contributor.authorVerbist, Agnes
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorGuo, Bin
dc.contributor.authorSeveri, Simone
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorHaspeslagh, Luc
dc.contributor.authorTilmans, Harrie
dc.contributor.authorNaito, Yasuyuki
dc.contributor.authorOnishi, K.
dc.contributor.imecauthorHelin, Philippe
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorHaspeslagh, Luc
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.date.accessioned2021-10-19T14:12:53Z
dc.date.available2021-10-19T14:12:53Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19055
dc.source.beginpage982
dc.source.conference16th International Solid-State Sensors, Acutators and Microsystems Conference - TRANSDUCERS
dc.source.conferencedate5/06/2011
dc.source.conferencelocationBeijing China
dc.source.endpage985
dc.title

A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator

dc.typeProceedings paper
dspace.entity.typePublication
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