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A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator

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1969 since deposited on 2021-10-19
3last month
Acq. date: 2026-08-18

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Views

1969 since deposited on 2021-10-19
3last month
Acq. date: 2026-08-18

Citations