Authors

Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Redolfi, Augusto; Thangaraju, Sarasvathi; Travaly, Youssef; Beyne, Eric; Swinnen, Bart

Conference

IEEE 61st Electronic Components and Technology Conference - ECTC

Title

Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications

Publication type

Proceedings paper