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Outperformance of Cu pillar flip chip bumps in electromigration testing

dc.contributor.authorLabie, Riet
dc.contributor.authorDosseul, Franck
dc.contributor.authorWebers, Tomas
dc.contributor.authorWinters, Christophe
dc.contributor.authorCherman, Vladimir
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-19T15:08:04Z
dc.date.available2021-10-19T15:08:04Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19229
dc.sourceIIOimport
dc.titleOutperformance of Cu pillar flip chip bumps in electromigration testing
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage312
dc.source.endpage316
dc.source.conference61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - imec


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