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Electromigration failure mechanisms for different flip chip configurations

dc.contributor.authorLabie, Riet
dc.contributor.authorWebers, Tomas
dc.contributor.authorWinters, Christophe
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCroes, Kristof
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDosseul, Franck
dc.date.accessioned2021-10-19T15:08:48Z
dc.date.available2021-10-19T15:08:48Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19231
dc.sourceIIOimport
dc.titleElectromigration failure mechanisms for different flip chip configurations
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage592
dc.source.endpage596
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate12/04/2011
dc.source.conferencelocationMonterey, CA USA
imec.availabilityPublished - imec


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