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Narrow pitch dual damascene patterning using EUV lithography in association with a spin-on trilayer resist system

dc.contributor.authorLazzarino, Frederic
dc.contributor.authorTruffert, Vincent
dc.contributor.authorVereecke, Bart
dc.contributor.authorDemuynck, Steven
dc.date.accessioned2021-10-19T15:16:34Z
dc.date.available2021-10-19T15:16:34Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19255
dc.sourceIIOimport
dc.titleNarrow pitch dual damascene patterning using EUV lithography in association with a spin-on trilayer resist system
dc.typeMeeting abstract
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorTruffert, Vincent
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecTruffert, Vincent::0000-0001-7851-830X
dc.source.peerreviewno
dc.source.beginpagePS-TuM1
dc.source.conferenceAVS 58th Annual International Symposium and Exhibition
dc.source.conferencedate30/10/2011
dc.source.conferencelocationNashville, TN US
imec.availabilityPublished - imec


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