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An investigation into damage-free thin die pick and place for 3D stacking

dc.contributor.authorMalachowski, Karl
dc.contributor.authorGonzales, Dennis
dc.contributor.authorMiller, Andy
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorHajdarevic, Zlatko
dc.contributor.authorSchnegg, Fabian
dc.contributor.authorArzberger, Anton
dc.date.accessioned2021-10-19T15:53:17Z
dc.date.available2021-10-19T15:53:17Z
dc.date.issued2011-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19359
dc.sourceIIOimport
dc.titleAn investigation into damage-free thin die pick and place for 3D stacking
dc.typeProceedings paper
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorLa Manna, Antonio
dc.source.peerreviewno
dc.source.conference13th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate7/12/2011
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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