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A detailed study of a novel wafer separation method for surface sensitive MEMS wafers

dc.contributor.authorMalachowski, Karl
dc.contributor.authorSeveri, Simone
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorSangameswaran, Sandeep
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorGenda, Satoshi
dc.contributor.authorTabuchi, Tomotaka
dc.contributor.authorUchiyama, Naoki
dc.date.accessioned2021-10-19T15:53:40Z
dc.date.available2021-10-19T15:53:40Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19360
dc.sourceIIOimport
dc.titleA detailed study of a novel wafer separation method for surface sensitive MEMS wafers
dc.typeOral presentation
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorVan Hoof, Rita
dc.source.peerreviewno
dc.source.conferenceMRS Fall Meeting Symposium TT: Microelectromechanical Systems: Materials and Devices V
dc.source.conferencedate28/11/2011
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec
imec.internalnotesPaper TT1.5


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