Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs

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Authors
Marinissen, Erik Jan; Daenen, Tom; Dupas, Luc; Van Dievel, Marc; Hanaway, Peter; Kiesewetter, Joerg; Smith, Ken; Strid, Eric; Thaerigen, Thomas
Conference
IEEE Semiconductor Wafer Test Workshop - SWTW
Title
Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
Publication type
Oral presentation
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