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Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorStucchi, Michele
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T16:57:23Z
dc.date.available2021-10-19T16:57:23Z
dc.date.issued2011-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19520
dc.sourceIIOimport
dc.titleCharacterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage861
dc.source.endpage868
dc.source.conference61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - imec


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