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Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding

dc.contributor.authorPham, Nga
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLimaye, Paresh
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorJansen, Roelof
dc.contributor.authorVan Hoovels, Nele
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-19T17:19:20Z
dc.date.available2021-10-19T17:19:20Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19572
dc.sourceIIOimport
dc.titleZero-level packaging for (RF-)MEMS implementing TSVs and metal bonding
dc.typeProceedings paper
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorJansen, Roelof
dc.contributor.imecauthorVan Hoovels, Nele
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecJansen, Roelof::0000-0001-6685-4699
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage1588
dc.source.endpage1595
dc.source.conference31th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - imec


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