Show simple item record

Thin MEMS packages obtained by a novel collective cap transfer process

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorNaito, Yasuyuki
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorOnishi, Keiji
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-19T17:20:36Z
dc.date.available2021-10-19T17:20:36Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19575
dc.sourceIIOimport
dc.titleThin MEMS packages obtained by a novel collective cap transfer process
dc.typeProceedings paper
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1505
dc.source.endpage1508
dc.source.conferenceEurosensors XXV
dc.source.conferencedate4/09/2011
dc.source.conferencelocationAthens Greece
imec.availabilityPublished - open access
imec.internalnotesProcedia Engineering; Vol. 25


Files in this item

Thumbnail
Name:
22727.pdf
Size:
705.0Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record