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The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model chemistry

dc.contributor.authorRadisic, Alex
dc.contributor.authorYang, Liu
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorBender, Hugo
dc.date.accessioned2021-10-19T17:48:58Z
dc.date.available2021-10-19T17:48:58Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19644
dc.sourceIIOimport
dc.titleThe bottom-up copper fill of Ø5μm × 40μm vias using 2-component model chemistry
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorBender, Hugo
dc.source.peerreviewno
dc.source.beginpage1949
dc.source.conference220th ECS Fall Meeting Symposium E5 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging
dc.source.conferencedate9/10/2011
dc.source.conferencelocationBoston, MA USA
dc.identifier.urlhttp://ecsmeet2.peerx-press.org/ms_files/ecsmeet2/2011/04/27/00001213/00/1213_0_art_0_lkbj8r.pdf
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; VOl. MA1102


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