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Evaluation of TSV and micro-bump probing for wide I/O testing
Publication:
Evaluation of TSV and micro-bump probing for wide I/O testing
Date
2011-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Smith, Ken
;
Hanaway, Peter
;
Jolley, Mike
;
Gleason, Reed
;
Strid, Eric
;
Daenen, Tom
;
Dupas, Luc
;
Knuts, Bruno
;
Marinissen, Erik Jan
;
Van Dievel, Marc
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1941
since deposited on 2021-10-19
Acq. date: 2025-10-28
Citations
Metrics
Views
1941
since deposited on 2021-10-19
Acq. date: 2025-10-28
Citations