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Evaluation of TSV and micro-bump probing for wide I/O testing

dc.contributor.authorSmith, Ken
dc.contributor.authorHanaway, Peter
dc.contributor.authorJolley, Mike
dc.contributor.authorGleason, Reed
dc.contributor.authorStrid, Eric
dc.contributor.authorDaenen, Tom
dc.contributor.authorDupas, Luc
dc.contributor.authorKnuts, Bruno
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorVan Dievel, Marc
dc.date.accessioned2021-10-19T19:03:05Z
dc.date.available2021-10-19T19:03:05Z
dc.date.issued2011-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19809
dc.sourceIIOimport
dc.titleEvaluation of TSV and micro-bump probing for wide I/O testing
dc.typeProceedings paper
dc.contributor.imecauthorDaenen, Tom
dc.contributor.imecauthorDupas, Luc
dc.contributor.imecauthorKnuts, Bruno
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorVan Dievel, Marc
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.conferenceIEEE International Test Conference - ITC
dc.source.conferencedate20/09/2011
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - imec


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