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Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs

dc.contributor.authorThaerigen, Thomas
dc.contributor.authorKanev, Stojan
dc.contributor.authorKiesewetter, Joerg
dc.contributor.authorHanaway, Peter
dc.contributor.authorStrid, Eric
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorDupas, Luc
dc.date.accessioned2021-10-19T19:36:24Z
dc.date.available2021-10-19T19:36:24Z
dc.date.issued2011-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19880
dc.sourceIIOimport
dc.titleWafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorDupas, Luc
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.conferenceSemicon 13th European Manufacturing Test Conference - EMTC
dc.source.conferencedate12/10/2011
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttp://semiconeuropa.org/ProgramsandEvents/TestandAdvancedPackaging/CTR_030445
imec.availabilityPublished - imec


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