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Simulating plasma + surface processes for the etching of silicon wtih an Ar/Cl2/O2 inductively coupled plasma

dc.contributor.authorTinck, Stefan
dc.contributor.authorBogaerts, Annemie
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-19T19:42:09Z
dc.date.available2021-10-19T19:42:09Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19893
dc.sourceIIOimport
dc.titleSimulating plasma + surface processes for the etching of silicon wtih an Ar/Cl2/O2 inductively coupled plasma
dc.typeMeeting abstract
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference4th International Workshop on Plasma Etch and Strip in Microelectronics - PESM
dc.source.conferencedate5/05/2011
dc.source.conferencelocationMechelen Belgium
imec.availabilityPublished - open access


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