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Evaluation of Mn-based Cu barriers for interconnect applications

dc.contributor.authorVan Besien, Els
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorZhao, Larry
dc.contributor.authorCroes, Kristof
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-19T20:09:32Z
dc.date.available2021-10-19T20:09:32Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19949
dc.sourceIIOimport
dc.titleEvaluation of Mn-based Cu barriers for interconnect applications
dc.typeOral presentation
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.source.peerreviewno
dc.source.conferenceAVS 58th International Symposium and Exhibition
dc.source.conferencedate30/10/2011
dc.source.conferencelocationNashville, TN USA
dc.identifier.urlhttp://www.avssymposium.org/
imec.availabilityPublished - imec
imec.internalnotesAbstract available on conference website


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