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Flipchip bonding of thin Si dies onto PET foils: possibilities and applications

dc.contributor.authorvan den Brand, Jeroen
dc.contributor.authorKusters, Roel
dc.contributor.authorCauwe, Maarten
dc.contributor.authorvan den Ende, Daan
dc.contributor.authorErinc, Muge
dc.date.accessioned2021-10-19T20:13:09Z
dc.date.available2021-10-19T20:13:09Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19956
dc.sourceIIOimport
dc.titleFlipchip bonding of thin Si dies onto PET foils: possibilities and applications
dc.typeProceedings paper
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceProceedings of the 18th European Microelectronics and Packaging Conference - EMPC
dc.source.conferencedate12/09/2011
dc.source.conferencelocationPiscataway, NJ USA
imec.availabilityPublished - open access


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