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dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorDelabie, Annelies
dc.contributor.authorDewilde, Sven
dc.contributor.authorMeersschaut, Johan
dc.contributor.authorSwerts, Johan
dc.contributor.authorTielens, Hilde
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorWitters, Thomas
dc.contributor.authorVancoille, Eric
dc.date.accessioned2021-10-19T20:19:53Z
dc.date.available2021-10-19T20:19:53Z
dc.date.issued2011-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19971
dc.sourceIIOimport
dc.titleALD barrier deposition on porous low-k dielectric materials for interconnects
dc.typeProceedings paper
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorDelabie, Annelies
dc.contributor.imecauthorMeersschaut, Johan
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorTielens, Hilde
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorVancoille, Eric
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.contributor.orcidimecMeersschaut, Johan::0000-0003-2467-1784
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.source.peerreviewno
dc.source.beginpage25
dc.source.endpage32
dc.source.conferenceAtomic Layer Deposition Applications 7
dc.source.conferencedate9/10/2011
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec
imec.internalnotesECS Transactions, Vol. 41, Issue 2


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