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TiSi2 and CoSi2: relevant materials issues for deep sub-micron technologies

dc.contributor.authorMaex, Karen
dc.contributor.authorHoward, Dave
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorSteegen, An
dc.date.accessioned2021-09-30T09:17:33Z
dc.date.available2021-09-30T09:17:33Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2008
dc.sourceIIOimport
dc.titleTiSi2 and CoSi2: relevant materials issues for deep sub-micron technologies
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorDe Wolf, Ingrid
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage72
dc.source.conferenceAbstracts of the 4th International Workshop on Stress Induced Phenomena in Metallization
dc.source.conferencedate4/06/1997
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - open access


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