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Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections

dc.contributor.authorZhang, Wenqi
dc.contributor.authorDimcic, Biljana
dc.contributor.authorLimaye, Paresh
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-19T22:20:41Z
dc.date.available2021-10-19T22:20:41Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20210
dc.sourceIIOimport
dc.titleNi/Cu/Sn bumping scheme for fine-pitch micro-bump connections
dc.typeProceedings paper
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage109
dc.source.endpage113
dc.source.conference61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - open access


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