Publication:
Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices – Technology directions
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1786 since deposited on 2021-10-20
1last month
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Acq. date: 2026-01-10
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Metrics
Views
1786 since deposited on 2021-10-20
1last month
1last week
Acq. date: 2026-01-10
Citations