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Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices – Technology directions

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T10:05:58Z
dc.date.available2021-10-20T10:05:58Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20360
dc.sourceIIOimport
dc.titleElectrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices – Technology directions
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage6
dc.source.conference2011 IEEE International 3D Systems Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/document/6262977/?arnumber=6262977
imec.availabilityPublished - imec
imec.internalnotes(2011 conference postponed due to earthquake disaster)


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