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Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch

dc.contributor.authorBogaerts, Lieve
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorGerets, Carine
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorLa Manna, Antonio
dc.date.accessioned2021-10-20T10:07:01Z
dc.date.available2021-10-20T10:07:01Z
dc.date.issued2012-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20372
dc.sourceIIOimport
dc.titleProcess related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
dc.typeProceedings paper
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.source.peerreviewyes
dc.source.conference14th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate5/12/2012
dc.source.conferencelocationSingapore Singapore
imec.availabilityPublished - imec


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