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3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

dc.contributor.authorBuisson, Thibault
dc.contributor.authorDe Preter, Inge
dc.contributor.authorSuhard, Samuel
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorJaenen, Patrick
dc.contributor.authorWitters, Thomas
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorJourdain, Anne
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T10:10:17Z
dc.date.available2021-10-20T10:10:17Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20405
dc.sourceIIOimport
dc.title3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
dc.typeProceedings paper
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecWitters, Thomas::0000-0002-8528-9469
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.source.peerreviewyes
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam Netherlands
imec.availabilityPublished - imec


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