Publication:
Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects
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1857 since deposited on 2021-10-20
2last month
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Acq. date: 2026-02-26
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Statistics
Views
1857 since deposited on 2021-10-20
2last month
1last week
Acq. date: 2026-02-26
Citations