dc.contributor.author | Civale, Yann | |
dc.contributor.author | Armini, Silvia | |
dc.contributor.author | Philipsen, Harold | |
dc.contributor.author | Redolfi, Augusto | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | El-Mekki, Zaid | |
dc.contributor.author | Vandersmissen, Kevin | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Swinnen, Bart | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-20T10:18:37Z | |
dc.date.available | 2021-10-20T10:18:37Z | |
dc.date.issued | 2012 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20467 | |
dc.source | IIOimport | |
dc.title | Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Armini, Silvia | |
dc.contributor.imecauthor | Philipsen, Harold | |
dc.contributor.imecauthor | Redolfi, Augusto | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | El-Mekki, Zaid | |
dc.contributor.imecauthor | Vandersmissen, Kevin | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
dc.contributor.orcidimec | Philipsen, Harold::0000-0002-5029-1104 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | yes | |
dc.source.conference | 62th Electronic Components and Technology Conference - ECTC | |
dc.source.conferencedate | 29/05/2012 | |
dc.source.conferencelocation | San Diego, CA USA | |
imec.availability | Published - imec | |