Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Reliability challenges during different phases of 3D SIC processing
Publication:
Reliability challenges during different phases of 3D SIC processing
Copy permalink
Date
2012
Meeting abstract
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Croes, Kristof
;
Civale, Yann
;
Labie, Riet
;
Li, Yunlong
;
De Messemaeker, Joke
;
Vanstreels, Kris
;
Redolfi, Augusto
;
Velenis, Dimitrios
;
Varela Pedreira, Olalla
;
Van De Peer, Myriam
;
Cherman, Vladimir
;
Vandevelde, Bart
;
Beyne, Eric
;
De Wolf, Ingrid
Journal
Abstract
Description
Metrics
Views
1906
since deposited on 2021-10-20
2
last month
1
last week
Acq. date: 2025-12-16
Citations
Metrics
Views
1906
since deposited on 2021-10-20
2
last month
1
last week
Acq. date: 2025-12-16
Citations