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Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process

dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorMiller, Andy
dc.contributor.authorBex, Pieter
dc.contributor.authorRebibis, Kenneth June
dc.date.accessioned2021-10-20T10:26:54Z
dc.date.available2021-10-20T10:26:54Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20518
dc.sourceIIOimport
dc.titleUnderstanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process
dc.typeMeeting abstract
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference9th Annual International Wafer-Level Packaging Conference - IWLPC
dc.source.conferencedate5/11/2012
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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