Thermal mismatch induced reliability issues for Cu filled through-silicon vias

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Authors
De Messemaeker, Joke; Croes, Kristof; Vandevelde, Bart; Velenis, Dimitrios; Redolfi, Augusto; Jourdain, Anne; Beyer, Gerald; Swinnen, Bart; Beyne, Eric; De Wolf, Ingrid
Conference
4th Electronics System Integration Technologies Conference - ESTC
Title
Thermal mismatch induced reliability issues for Cu filled through-silicon vias
Publication type
Proceedings paper
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