Publication:

Thermal mismatch induced reliability issues for Cu filled through-silicon vias

Date

2012

Proceedings Paper

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Author(s)

De Messemaeker, Joke

;

;

Vandevelde, Bart

;

Velenis, Dimitrios

;

Redolfi, Augusto

;

;

;

;

;

De Wolf, Ingrid

Statistics

1806 since deposited on 2021-10-20

Acq. date: 2026-05-02