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Thermal mismatch induced reliability issues for Cu filled through-silicon vias

dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorCroes, Kristof
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-20T10:32:51Z
dc.date.available2021-10-20T10:32:51Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20551
dc.sourceIIOimport
dc.titleThermal mismatch induced reliability issues for Cu filled through-silicon vias
dc.typeProceedings paper
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
imec.availabilityPublished - imec


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