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In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs
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Authors
De Wolf, Ingrid
;
Simons, Veerle
;
Cherman, Vladimir
;
Labie, Riet
;
Vandevelde, Bart
;
Beyne, Eric
Conference
62nd Electronic Components & Technology Conference - ECTC
Title
In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs
Publication type
Proceedings paper
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