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In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorSimons, Veerle
dc.contributor.authorCherman, Vladimir
dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T10:36:14Z
dc.date.available2021-10-20T10:36:14Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20570
dc.sourceIIOimport
dc.titleIn-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage331
dc.source.endpage337
dc.source.conference62nd Electronic Components & Technology Conference - ECTC
dc.source.conferencedate29/05/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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