Authors

Goloudina, S.I.; Ivanov, A.S.; Krishtab, M.B.; Luchinin, V.V.; Pasyuta, V.M.; Gofman, I.V.; Sklizkova, V.P.; Kudryavtsev, V.V.; Baklanov, Mikhaïl

Conference

Interconnect Challenges for CMOS Technology - Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking

Title

Pore sealing of SiOCH ultra low-k dielectrics with polyimide Langmuir-Blodgett film

Publication type

Proceedings paper