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Pore sealing of SiOCH ultra low-k dielectrics with polyimide Langmuir-Blodgett film

dc.contributor.authorGoloudina, S.I.
dc.contributor.authorIvanov, A.S.
dc.contributor.authorKrishtab, M.B.
dc.contributor.authorLuchinin, V.V.
dc.contributor.authorPasyuta, V.M.
dc.contributor.authorGofman, I.V.
dc.contributor.authorSklizkova, V.P.
dc.contributor.authorKudryavtsev, V.V.
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-20T11:14:40Z
dc.date.available2021-10-20T11:14:40Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20732
dc.sourceIIOimport
dc.titlePore sealing of SiOCH ultra low-k dielectrics with polyimide Langmuir-Blodgett film
dc.typeProceedings paper
dc.source.peerreviewyes
dc.source.beginpagemrss12-1428-c02-
dc.source.conferenceInterconnect Challenges for CMOS Technology - Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking
dc.source.conferencedate9/04/2012
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 1428


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