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Chip package interaction (CPI): thermo mechanical challenges in 3D technologies

dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDebecker, Bjorn
dc.contributor.authorLofrano, Melina
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T11:15:28Z
dc.date.available2021-10-20T11:15:28Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20735
dc.sourceIIOimport
dc.titleChip package interaction (CPI): thermo mechanical challenges in 3D technologies
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conference14th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate5/12/2012
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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