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3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

dc.contributor.authorGuo, Wei
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorEneman, Geert
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCivale, Yann
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorBuisson, Thibault
dc.contributor.authorJourdain, Anne
dc.contributor.authorVandevelde, Bart
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-20T11:23:43Z
dc.date.available2021-10-20T11:23:43Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20764
dc.sourceIIOimport
dc.title3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
dc.typeProceedings paper
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceIEEE International Conference on IC Design and technology - ICICDT
dc.source.conferencedate30/05/2012
dc.source.conferencelocationAustin, TX USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6232855
imec.availabilityPublished - imec


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