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In-line metrology and inspection for process control during 3D stacking of IC�s

dc.contributor.authorHalder, Sandip
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T11:25:16Z
dc.date.available2021-10-20T11:25:16Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20769
dc.sourceIIOimport
dc.titleIn-line metrology and inspection for process control during 3D stacking of IC�s
dc.typeProceedings paper
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageP-1-32
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
imec.availabilityPublished - open access


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