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Cu-Cu hybrid bonding as option for 3D IC stacking

dc.contributor.authorHu, Yu-Hsiang
dc.contributor.authorLii, M.J.
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorJourdain, Anne
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyne, Eric
dc.contributor.authorYu, C.H.
dc.date.accessioned2021-10-20T11:42:10Z
dc.date.available2021-10-20T11:42:10Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20828
dc.sourceIIOimport
dc.titleCu-Cu hybrid bonding as option for 3D IC stacking
dc.typeProceedings paper
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2012
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - open access


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