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3D stacking using Cu-Cu direct bonding

dc.contributor.authorHu, Yu-Hsiang
dc.contributor.authorLiu, C.S.
dc.contributor.authorLii, M.J.
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorJourdain, Anne
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorYu,
dc.date.accessioned2021-10-20T11:42:28Z
dc.date.available2021-10-20T11:42:28Z
dc.date.issued2012-02
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20829
dc.sourceIIOimport
dc.title3D stacking using Cu-Cu direct bonding
dc.typeProceedings paper
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1-Mar
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
imec.availabilityPublished - open access


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